Ion plating
0605101-83
[DEFINITION]
A vapor deposition in which the vaporized particles are ionized or
energized in plasma and deposited on the substrate by applying kinetic energy through an electrical
field.
[DESCRIPTION]
This is a composite technology combining vacuum deposition and
plasma technology. Whereas in the conventional vacuum deposition process, most of the particles
that reach the substrate are neutral, in this method, the particles are ions, excited particles, and
radicals with internal energy and kinetic energy. Therefore, compared with vacuum deposition, the
structure and properties of the plated film are much more elaborate. Because the deposition rate is
also high and the properties of the film are good, this method is used extensively instead of
electroplating, especially in the production of a layer on nonconductive materials.
[References]
(4)(9)
[Related Terms]
Vapor deposition