surface activated bonding, SAB


[DEFINITION]
process for bonding two substrates directly by increasing the surface energy of each substrate using ion beam or plasma irradiation.(IEC/2015)

[DESCRIPTION]

Surface activated bonding is effective in reducing thermal stress because the temperature in the bonding process is comparably low. In MEMS devices, surface activated bonding is expected to be applied to the substrate bonding such as hermetic sealing.



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[Related Terms]