| Opening Remarks 丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂 Chairperson: Keiichi Aoyagi,
Micromachine Center丂 |
| 9:00亅 9:05 |
Opening Remarks |
Tamotsu Nomakuchi, Micromachine Cente |
| 9:05亅 9:10 |
Guest Speech |
Taizo Takahashi, Industrial Machinery Division,丂Manufacturing Industries
Bureau, METI
|
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Keynote Session丂丂丂丂Towards the Next Generation of MEMS丂丂丂
丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂Chairperson: Keiichi
Aoyagi, Micromachine Center |
| 9:15亅10:00丂 |
Advances in Research and Applications of Integrated MEMS in Japan |
|
Shimoyama, The University of Tokyo |
| 10:00亅10:45 |
Advances in MEMS Integration : MEMS First or MEMS Last? |
| 丂丂丂丂丂 |
Thomas W. Kenny ( Stanford University ) |
|
Session 1丂 丂丂丂丂丂丂Cutting Edge of MicroNano Science and Technology
丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂Chairperson: Osamu Tabata, Kyoto University |
| 10:45-11:15 |
Fusion of Top-down and Bottom-up Processing Using Neutral Beam |
|
Seiji Samukawa, Tohoku University |
| 11:15-11:45 |
Preparation and Properties of Multicomponent Nanocrystal Superlattices |
|
Christpher B. Murray , IBM, The T.J. Watson Reserch Center |
| 11:45-12:15 |
Organic and Organic-Inorganic Hybrid Molecular Devices |
|
Cherie R. Kagan, IBM, The T.J. Watson Reserch Center |
|
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|
| 12:15-13:30 |
丂丂丂丂丂丂丂丂============丂Lunch丂============ |
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Session 2丂 丂丂丂丂丂丂Forefront of MEMS Business
丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂Chairperson: Isao Shimoyama, The University of Tokyo |
| 13:30-14:00 |
CMOS/ MEMS Monolithic Integration, Key to Success of LSI Silicon Resonators
|
|
Emmanuel Quevy, Silicon Clocks Inc. |
| 14:00-14:30 |
Reconfigurable RF Circuits for Future Mobile Terminals |
|
Shoichi NARAHASHI, NTT DoCoMo, Inc. |
| 14:30-15:00 |
Development of Medical Devices for Minimally Invasive Diagnostics and Treatment
Using Micro/nano Technology |
|
Yoichi Haga, Tohoku University |
| 15:00-15:30 |
MEMS@Bosch - Automotive Applications and beyond |
|
Peter Ernst, Robert BOSCH GmbH |
|
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|
| 15:30-15:50 |
丂丂丂丂丂丂丂丂============丂Break丂============ |
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Session 3丂 丂丂丂丂丂丂CMOS/MEMS & MEMS/MEMS Integration
丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂Chairperson: Takashi Usuda, AIST丂 |
| 15:50-16:20 |
CMOS/ MEMS Integration by Poly Si Ge |
|
Kris Baert, IMEC |
| 16:20-16:50 |
Carbon Nanotube-based Machine Elements for Nano-scale Mechanisms and Technologies
Required to Transition Them From the Lab to Products |
|
Martin Culpepper, Massachusetts Institute of Technology |
| 16:50-17:20 |
Advanced Packaging is the Breakthough Technology of MEMS Commerciarization |
|
Joerg Froemel, Fraunhofer IZM |
| 17:20-17:50 |
Optical MEMS towards Integration and Large Scale |
|
Hiroshi Toshiyoshi, The University of Tokyo |
|
| Closing |
| 17:50-17:55 |
Closing Remarks |
Keiichi Aoyagi, Micromachine Center |
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